Time: 3:00-4:00pm 25th Apr, 2011(Monday)
Location: Conference Room 326, the 3rd Academic Building, Yuquan Campus, Zhejiang University
Title: High speed low landing energy SEM system for wafer inspection systems from 100nm to 20nm design rule
Abstract :
A SORIL(Swing Objective Retarding Immersing Lens) column for wafer inspection is designed and constructed based on SOIL, which developed from MOL, VAL and SOL theory. The column consists of an energy spread controlled magnetic lens field emission gun. The designed retarding electrostatic and magnetic objective immersion lens has small spherical and chromatic aberrations coefficients for low landing energy. All electrostatic deflectors have a cylindrical dozapole(12-pole) structure. Especially, one deflector is accommodated between the pole-piece of magnetic lens and specimen surface, and operates at high voltage to fulfill SORIL condition. An on-axis annular semiconductor detector with a small hole in the center is employed to collect signal electrons. The annular detector achieves very high collection efficiency conveniently over a large scanning field. The SORIL column has accomplished a 600m 600m scanning field with 0.1m pixel size in a wide landing energy range (from 200eV to 3keV) without dynamic aberration correction and dynamic focusing. The new high resolution of 3nm is achieved in 50m 50m field of view at 1KeV landing energy. The highest scan pix rate is 400M Pix/Second. The probe beam current delivered by SORIL column is from a few nA to more than 250nA due to the special designed bright and stable field emission gun. These systems have been widely applied in advanced semiconductor fabs for current and next generation wafer manufacture.
Reporter introduction：
Chen Zhongwei received the B.Sc. degree from Tsinghua University, EE department in 1968, got the Master’s degree in Shan Dong Industrial University in 1981, and the Ph.D. degree in Cambridge University in 1989. He joined KLA Instruments Inc. USA in 1990 as a Senior Staff System Design Engineer to develop electron beam wafer inspection system. In 1998, he became the cofounder of Hermes-Microvision Inc.(HMI), which develop and manufacture world leading Low landing energy electron beam wafer inspection system for advanced semi-conductor manufacture companies. Currently he is the President of HMI-USA and Chairmen of HMI-China.